The Chinese tech juggernaut says it can match cutting-edge Intel semiconductors by 2031.
SHANGHAI—Huawei Technologies said it has developed a workaround that will allow it to make chips on par with leading products manufactured by Intel and other top global companies by 2031, the latest effort by the Chinese company to overcome U.S. semiconductor technology barriers.

The details
Huawei said its approach would allow it to make more-advanced chips without the one-of-a-kind machines its rivals use—equipment the U.S. has blocked it from accessing